Join MicroEJ and NXP Semiconductors at Embedded World 2024

Nuremberg, Germany

From April 9th – 11th , 2024

MicroEJ & NXP to Showcase Containerization at the Edge with Platform Accelerator at EW 24

MicroEJ integrates its VEE software container into the NXP Platform Accelerator to accelerate development, enable seamless app portability, and ease system integration.

Charles Dachs, Senior VP and GM, Industrial and IoT Edge at NXP, says: “Just like what happened in the smartphone industry, containerization can be a tremendous tool to drive the rapid development of new smart device platforms. By integrating MicroEJ’s software container with NXP’s broad portfolio of edge processing solutions, we equip engineers to bring more products to market faster, with reduced costs, and to support the continuous evolution of their smart devices across industrial and IoT markets.”

Dr Fred Rivard, CEO and founder at MicroEJ confirms: “Software portability and BoM optimization are often mutually exclusive. The NXP Platform Accelerator combines these two objectives, thanks to tiny software containers. This small-footprint innovation allows developers to benefit from both an optimized bill of materials and a modern software design process. This enables engineers to create new products and platforms more quickly, design products that are lower power and lower cost, while still allowing for feature-rich differentiation and innovation by device manufacturers.”

NXP Platform Accelerator Key Features:

  • Leverages mobile-like development processes with containerization at the edge
  • Streamlines system integration across NXP’s portfolio
  • Compatible with RTOS, Linux & Android

At Hall 4 Stand 4A-222, NXP will showcase a live demo of the solution for autonomous homes.

For more info about Platform Accelerator, go to: https://www.microej.com/software-container-nxp-semiconductors-mcu-mpu-crossover/

We look forward to meeting you at Embedded World 2024!